Key Points:
- TSMC reassures that 2nm chip mass production will start in 2025, despite previous delay concerns.
- Samsung accelerates its roadmap, aiming for 1nm chip production by 2026.
- TSMC addresses technical challenges with GAA transistor architecture, nearing its yield target.
TSMC, a leader in semiconductor technology, recently reaffirmed its commitment to launching 2nm chips by 2025. Despite previous reports hinting at potential delays until 2026, TSMC’s Vice President of Process Development, Zhang Xiaogang, confidently stated that the 2nm development is on track and progressing smoothly. This statement, made at a recent forum, counters earlier claims of significant technical hurdles that might push back the production timeline.
The earlier concerns revolved around TSMC’s adaptation to the Gate All Around (GAA) transistor architecture, a shift from the FinFET architecture used in its 3nm chips. This transition is crucial for enhancing power efficiency and reducing chip size. However, Zhang’s update indicates that TSMC has largely overcome these challenges, achieving a 90% yield ratio, close to their target. This positions TSMC to commence mass production as planned, with Apple’s A19 Pro for the iPhone 17 series likely being the first to feature these 2nm chips.
Meanwhile, Samsung, TSMC’s main competitor, is making strides to leapfrog in the semiconductor race. Initially set for 2027, Samsung has now moved up its timeline, targeting mass production of 1nm chips by 2026. This aggressive push will be detailed further at the upcoming SAFE Forum in Silicon Valley, where Samsung is expected to outline its semiconductor roadmap.
These developments mark significant milestones in the semiconductor industry, highlighting the intense competition and rapid technological advancements shaping the future of chip manufacturing.
