Samsung unveils industry’s thinnest LPDDR5X DRAM packages

Samsung
Samsung

Top 3 Key Points:

  1. Samsung starts mass production of 12nm-class, 12GB, and 16GB LPDDR5X DRAM packages.
  2. New DRAM packages are 9% thinner and 21.2% more heat resistant than previous versions.
  3. Samsung aims to supply these ultra-thin DRAMs to mobile device manufacturers, enhancing future devices’ performance.

Samsung Electronics, a global leader in advanced memory technology, has begun mass production of the industry’s thinnest 12nm-class, 12GB, and 16GB LPDDR5X DRAM packages. This move strengthens its position in the low-power DRAM market.

Using its extensive chip packaging expertise, Samsung has developed ultra-thin LPDDR5X DRAM packages that provide more space within mobile devices and improve airflow. This leads to better thermal management, which is crucial for high-performance applications with advanced features like on-device AI.

YongCheol Bae, executive vice president of memory product planning at Samsung Electronics, said, “Samsung’s LPDDR5X DRAM sets a new standard for AI solutions on high-performance devices, delivering superior performance and advanced thermal management in a compact package. We are committed to continuous innovation through close collaboration with our customers to meet future low-power DRAM market needs.”

Samsung’s new LPDDR5X DRAM package features the industry’s thinnest 12nm-class LPDDR DRAM with a 4-stack structure. It is approximately 9% thinner and 21.2% more heat-resistant than its predecessor. By optimizing printed circuit board (PCB) and epoxy molding compound (EMC) technologies, the new LPDDR DRAM package is just 0.65 millimeters (mm) thick, as thin as a fingernail, making it the slimmest among existing 12GB and above LPDDR DRAMs. Samsung also uses an optimized back-grinding process to minimize package height.

Samsung plans to expand the low-power DRAM market by supplying 0.65mm LPDDR5X DRAM to mobile processors and device manufacturers. As demand for high-performance, high-density mobile memory solutions in small package sizes grows, Samsung aims to develop 6-layer 24GB and 8-layer 32GB modules as the thinnest LPDDR DRAM packages for future devices.

Blight is an aspiring Samsung enthusiast and technology aficionado, dedicated to exploring the extraordinary realms facilitated by cutting-edge innovations. He is passionate about Artificial Intelligence (AI) and its potential to transform industries, enhance human experiences, and shape a better future. Fascinated by the delicate beauty and he is captivating essence of flowers, finding solace in their presence. He is constantly seeking knowledge and growth, eager to connect with like-minded individuals and build meaningful relationships.
Exit mobile version