Top 3 Key Points:
- Samsung starts mass production of 12nm-class, 12GB, and 16GB LPDDR5X DRAM packages.
- New DRAM packages are 9% thinner and 21.2% more heat resistant than previous versions.
- Samsung aims to supply these ultra-thin DRAMs to mobile device manufacturers, enhancing future devices’ performance.
Samsung Electronics, a global leader in advanced memory technology, has begun mass production of the industry’s thinnest 12nm-class, 12GB, and 16GB LPDDR5X DRAM packages. This move strengthens its position in the low-power DRAM market.
Using its extensive chip packaging expertise, Samsung has developed ultra-thin LPDDR5X DRAM packages that provide more space within mobile devices and improve airflow. This leads to better thermal management, which is crucial for high-performance applications with advanced features like on-device AI.
YongCheol Bae, executive vice president of memory product planning at Samsung Electronics, said, “Samsung’s LPDDR5X DRAM sets a new standard for AI solutions on high-performance devices, delivering superior performance and advanced thermal management in a compact package. We are committed to continuous innovation through close collaboration with our customers to meet future low-power DRAM market needs.”
Samsung’s new LPDDR5X DRAM package features the industry’s thinnest 12nm-class LPDDR DRAM with a 4-stack structure. It is approximately 9% thinner and 21.2% more heat-resistant than its predecessor. By optimizing printed circuit board (PCB) and epoxy molding compound (EMC) technologies, the new LPDDR DRAM package is just 0.65 millimeters (mm) thick, as thin as a fingernail, making it the slimmest among existing 12GB and above LPDDR DRAMs. Samsung also uses an optimized back-grinding process to minimize package height.
Samsung plans to expand the low-power DRAM market by supplying 0.65mm LPDDR5X DRAM to mobile processors and device manufacturers. As demand for high-performance, high-density mobile memory solutions in small package sizes grows, Samsung aims to develop 6-layer 24GB and 8-layer 32GB modules as the thinnest LPDDR DRAM packages for future devices.
