Samsung is climbing the boundaries of innovation as the Korean tech giant is reportedly analyzing the ways to use 3D chiplet to elevate Exynos chip productivity. The firm is considering applying next-generation packaging, to its self-developed mobile AP ‘Exynos’ series.
As per the information, 3D chiplet is a technology that has been attracting attention mainly in advanced semiconductor fields such as HPC and AI. It is evaluated that it can bring various advantages to mobile APs, such as miniaturization and improved performance.
An official said,
- “Samsung Electronics is internally considering applying 3D chiplets to Exynos,” adding, “The judgment was that there were significant benefits that could be gained through this.”
Chiplet is a next-generation packaging technology that manufactures semiconductors with different functions and connects them into one chip. However, if Samsung finds out a way to use this chiplet, then the performance and efficiency of the devices will reach a new level.
