SK Hynix has recently developed reusable CMP pad technology to reduce costs and strengthen ESG management. The manufacturer also plans to sequentially expand the application of reusable CMP pads starting from low-risk processes.
CMP pads are consumable products used to flatten semiconductor wafers and are an essential material component to ensure wafer uniformity.
As per the details, SK Hynix secured reusable pad technology by approaching the CMP pad surface pattern reconstruction method. This will not only reduce cost but will also implement an eco-friendly semiconductor process.
About 70% of the domestic semiconductor manufacturing industry uses foreign products and the high dependence on foreign countries, domestic production was a task for the semiconductor industry.
