Here are the key takeaways:
- Exynos Overheating: Samsung’s Exynos processors have faced criticism for overheating, prompting the company to seek solutions.
- FOWLP-HPB Heatsink: A new chip packaging technology called FOWLP-HPB integrates a heat path block directly onto the Exynos chip, enhancing heat dissipation.
- Potential Benefits: This technology could lead to cooler-running Exynos chips, improved performance, and the possibility of incorporating multiple processing cores in future iterations.
In a bid to combat overheating issues, Samsung is developing a novel heatsink technology for its Exynos mobile processors. This innovation, called FOWLP-HPB (fan-out wafer-level package-heat path block), promises to improve thermal management and potentially pave the way for future multi-die chipsets.
Samsung’s Exynos processors have garnered a reputation for overheating, particularly under demanding workloads. This has led to concerns about performance throttling and user experience. To address these issues, Samsung is reportedly developing a new chip packaging technology called FOWLP-HPB (fan-out wafer-level package-heat path block).
This innovative approach involves integrating a dedicated heat path block (HPB) directly onto the Exynos chip. HPBs are commonly used in server and PC processors for efficient heat dissipation. By incorporating this technology into mobile chipsets, Samsung aims to significantly improve thermal management in Exynos processors.
The development of FOWLP-HPB is being spearheaded by Samsung’s Advanced Package (AVP) business unit within the chip division. The technology is expected to be finalized by the fourth quarter of 2024, paving the way for mass production. Additionally, Samsung is exploring the development of a follow-up technology called FOWLP-SIP (system-in-package), which could enable the integration of multiple processing cores within a single package.
This development comes amidst Samsung’s reported consideration of adopting MediaTek’s Dimensity processors for the upcoming Galaxy S25 series. The rationale behind this move is believed to be centered on improving yield rates and potentially securing more favorable pricing from Qualcomm, another major chip supplier. However, the new FOWLP-HPB heatsink technology is expected to be implemented in the next generation of Exynos chips, potentially debuting in the Galaxy S26 series if mass production commences as planned.
The rise of on-device artificial intelligence (AI) has further accentuated the need for efficient thermal management in mobile processors. Traditional methods, such as vapor chamber cooling with refrigerants, are becoming increasingly challenged by the demands of advanced processing tasks. Samsung’s FOWLP-HPB technology represents a significant step forward in tackling thermal issues and could pave the way for a new era of more powerful and thermally efficient Exynos processors.
