Key Points
- Samsung Expands Chip Packaging Coalition: Samsung has increased its semiconductor packaging coalition from 20 to 30 members this year.
- Launch of Multi-Die Integration Alliance: The Multi-Die Integration (MDI) Alliance was introduced to enhance chipset and heterogeneous integration technologies.
- Competition with TSMC: Samsung aims to challenge TSMC’s dominance in high-end chip packaging through innovative alliances and advanced integration techniques.
In a strategic move to strengthen its position in the semiconductor industry, Samsung has expanded its chip packaging coalition by adding ten new members, bringing the total to 30 this year. This expansion is part of Samsung’s efforts to enhance its semiconductor packaging technologies and compete more effectively with industry leader TSMC.
According to Business Korea, Samsung Foundry’s new additions bolster its 2.5D and 3D MDI Alliance, a coalition launched in June 2023. The Multi-Die Integration (MDI) Alliance is designed to advance chipset and heterogeneous integration, allowing for more flexible and efficient chip designs.
TSMC, Samsung’s primary competitor, continues to push the boundaries of high-end packaging with its 3D Fabric Alliance, which boasts over 20 partners. TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) technology has set a high bar in the industry, known for its reliability and advanced capabilities.
An industry insider noted, “Samsung Electronics is working diligently to challenge TSMC’s dominance with innovative heterogeneous integration packaging technologies like i-Cube. However, TSMC’s established reliability and technological prowess present significant challenges. Samsung Foundry must leverage its open ecosystem, exemplified by the MDI Alliance, to close the gap.”
Samsung’s concerted efforts to expand its coalition and innovate in chip packaging signal a robust strategy to rival TSMC and potentially reshape the competitive landscape of the semiconductor industry.
