Samsung Electronics developed 2.3D packaging to compete with Intel and TSMC

Samsung 2.3D packaging

Samsung Electronics has developed 2.3D a next-generation semiconductor packaging technology to compete with most leading manufacturers Intel and TSMC. To be mentioned, it has reached a level of completeness that allows for mass production with customers

As per the information, 2.3D packaging technology is used to manufacture high-performance semiconductors such as artificial intelligence (AI). Samsung is assessed to have established an important foothold in the AI ​​semiconductor industry led by Intel and TSMC.

Kim Gu-young, head of the process development team at Samsung Electronics AVP said,

“We have developed it and are preparing for mass production with major customers,” he said. Team Leader Kim added, “Several major companies are showing interest,” adding, “We plan to have mass production infrastructure in place by next year.”

However, the Korean tech giant has replaced the silicon interposer with a ‘silicon bridge, as this method adds silicon only to necessary areas instead of the entire semiconductor area. Accordingly, a silicon bridge is inserted into the redistribution layer which is essential for packaging.

Via

Blight is an aspiring Samsung enthusiast and technology aficionado, dedicated to exploring the extraordinary realms facilitated by cutting-edge innovations. He is passionate about Artificial Intelligence (AI) and its potential to transform industries, enhance human experiences, and shape a better future. Fascinated by the delicate beauty and he is captivating essence of flowers, finding solace in their presence. He is constantly seeking knowledge and growth, eager to connect with like-minded individuals and build meaningful relationships.
Exit mobile version