Samsung Electronics has developed 2.3D a next-generation semiconductor packaging technology to compete with most leading manufacturers Intel and TSMC. To be mentioned, it has reached a level of completeness that allows for mass production with customers
As per the information, 2.3D packaging technology is used to manufacture high-performance semiconductors such as artificial intelligence (AI). Samsung is assessed to have established an important foothold in the AI semiconductor industry led by Intel and TSMC.
Kim Gu-young, head of the process development team at Samsung Electronics AVP said,
“We have developed it and are preparing for mass production with major customers,” he said. Team Leader Kim added, “Several major companies are showing interest,” adding, “We plan to have mass production infrastructure in place by next year.”
However, the Korean tech giant has replaced the silicon interposer with a ‘silicon bridge, as this method adds silicon only to necessary areas instead of the entire semiconductor area. Accordingly, a silicon bridge is inserted into the redistribution layer which is essential for packaging.
