Samsung Electronics announced on its official website on June 30 that it adopted a 3nm process technology with a full-surround gate transistor architecture, and began preliminary production of chips on the same day, taking the lead in the industry to start using 3nm process technology foundry wafers.
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The latest reports from the Korean media show that the first batch of chips manufactured by Samsung Electronics using the 3nm process technology are scheduled to be shipped on July 25, and they will hold a shipping ceremony for this.
The Korean media also mentioned in the report that the 3nm process chip that Samsung Electronics is scheduled to ship on July 25 is OEM for a domestic manufacturer, which means that the first batch of smartphones is not OEM for a processor.
In addition, the Korean media also mentioned in the report that the first batch of chips produced by Samsung Electronics using the 3nm process technology was found in the factory in Hwaseong, not the Pyeongtaek factory.
The Pyeongtaek factory, which started mass production in 2017, has Samsung’s most advanced chip production equipment, and Hwaseong is the R&D base for Samsung’s advanced process technology. Korean media also believe that this indicates that the first batch of production will be relatively small, not many.
However, the chips manufactured by Samsung’s 3nm process technology are scheduled to be shipped on July 25, which is only a report from the source, and Samsung Electronics has not announced relevant news. However, if it is shipped on the 25th as reported, it means that the chips manufactured by Samsung’s process technology will also be the first to be shipped in the industry, ahead of its competitor TSMC.
When it announced on its official website on June 30 that it started to use the 3nm process technology to manufacture wafers for customers, Samsung Electronics disclosed that compared with the 5nm process technology, the first-generation 3nm process technology using the full-surround gate transistor architecture The power consumption is reduced by 45%, the performance is improved by 23%, and the chip area is reduced by 16%.
Like TSMC, the sources said that Samsung Electronics’ 3nm process technology will also have a second generation, and they plan to mass-produce it in 2023.
