Samsung hired Lin Jun-cheng as its new Senior Vice President of the advanced packaging team under its chip business decision, Device solution, a report reveals (via). Lin previously worked at Taiwan-based TSMC.
KoreaHerald believes that Lin Jun-cheng’s key responsibility is likely to be overseeing the development of cutting-edge packaging technology, which plays a key role in enhancing advanced higher-performance chipsets.
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From 1999 to 2017, Lin worked at TSMC and then served as CEO of Taiwanese semiconductor equipment maker Skytech. It shows how Samsung beefs up efforts to strengthen its prowess in chip packaging under the leadership of Samsung’s co-CEO Kyung Kye-hyun.
Galaxy-exclusive chipset
In the recent past, the South Korean tech giant established a dedicated team as part of research and development on its dream chipset. To speed up the development and accuracy of the project, the company is continuously putting in efforts and hiring expertise from various tech titans.
A task force is also said to have been launched last year to speed up the commercialization of advanced packaging technology. Last year, Samsung also hired Kim Woo-pyeong, a former engineer at Apple – another archrival – as head of the company’s packaging solution center in the US.
