Samsung Electronics has recently introduced an advanced packaging technology called Fan-out Wafer Level Packaging (FOWLP)’ into its mass production line. With this cutting-edge tech, Samsung aims to capture the packaging market led by TSMC.
As per the details, FOWLP is a core technology that helped TSMC rise to become the world’s No. 1 foundry and is considered an important packaging tech to improve the limits of semiconductor integration. This will further reduce chip thickness and save both time and cost.
Samsung Electronics has completed verification of FOWLP technology and began mass production. With the mass production and delivery of FOWLP, the firm has launched a full-fledged pursuit of TSMC in the high-tech packaging market.
An industry official said,
- “We have recently begun mass production of FOWLP technology and have established all mass production infrastructure.”
- “The ‘mass production’ project that started this year will continue to expand in the future.”
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